Why 6G when 5G is already so fast?
New book explains why with the 7 Cs of Future Communications
Book AnnouncementIMAGE: COVER FOR "FROM 5G TO 6G AND BEYOND: THE 7 CS OF FUTURE COMMUNICATIONS" view more
CREDIT: WORLD SCIENTIFIC
Why should countries invest in 6G networks when existing 5G networks are already so powerful? This question might seem irrelevant now, but it will shape the future of countries and businesses.
These days, people are not just accessing digital information in real time but also watching movies, playing games, and enjoying multimedia data streaming services even when onboard airplanes and trains traveling at very high speeds. As human society evolves towards a more data- and network-oriented world, consumers and service providers are seeking more advanced communication systems that offer lower latency, higher bandwidth, and larger data capacities. Hence, efforts are underway to consider beyond state-of-the-art protocols, future chip design and integration, and even standardized guidelines for 6G wireless communication systems.
With wireless connectivity becoming ubiquitous, a future where applications like virtual and augmented reality, artificial intelligence (AI), machine learning and even autonomous vehicles requiring high data rates combined with extremely low latencies, or delays, due to processing time may arrive sooner than we think—if we have the right network architecture to support such a reality. Accordingly, 6G, with its peak data rate of 1 Terabit per second and latency of 100 microseconds, should be able to smoothly support these use cases. At the same time, individuals and organisations will expect a trustworthy network that can seamlessly and securely deliver data—meaning that further research must focus on building a holistic 6G network security architecture.
Written by four IEEE Fellows, one Chief Executive Officer, and several leading experts in communications and semiconductors, From 5G to 6G and Beyond: The 7 Cs of Future Communications covers all aspects of future communications from key technologies, design challenges, network requirements and users' experiences to standardization, chip design and industry applications from 5G to 6G. It demonstrates how two seemingly unrelated technologies in the past can be integrated to create new solutions for the future.
Power consumption is another major consideration when designing future networks. This is because of the current power needs of 5G networks; as explained by Huawei in July 2020 , while the “Energy consumption per unit of data (watt/bit) is much less for 5G than 4G … power consumption is much higher [than 4G networks]”. To address this problem, we must target to deliver the next generation networks that, at their introduction time, does not surpass the previous generation’s energy needs.
Therefore, the next generation of wireless communications and semiconductor technology is expected to work together to meet the energy needs and demands of various challenging use cases that cover a wide range of new applications; from 5G/6G communications, mobile computing, artificial intelligence, and advanced internet of things, to big data, cloud, and edge computing.
From 5G to 6G and Beyond discusses the open problems of future communication systems and chip design, and present new solutions that address these challenges. Specifically, the role of semiconductors in future communications are discussed. The use cases of 6G, the RF transceivers roadmap for 2030 and beyond, as well as the modelling of RF devices for 5G/6G are presented. Additionally, a modified Shannon’s capacity formula that is critical for future advanced wireless communications, is examined for the first time. The standardization of 6G wireless communication systems, with emphasis on Standard Development Organizations (SDOs), regulatory bodies and administrations, ITU, industry forums, and 6G standard timeline, is reported. Finally, the design of RF/mm-wave integrated circuits and systems, which includes voltage-controlled oscillators, power amplifiers, low-noise amplifiers, frequency synthesizers, high-frequency dividers, and chip-to-chip communications isolation technology, is described.
From 5G to 6G and Beyond: The 7 Cs of Future Communications retails for US$118 / £105 (hardcover) and is also available in electronic formats. To order or know more about the book, visit http://www.worldscientific.com/worldscibooks/10.1142/13265.
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About the Editor
Professor Kiat Seng YEO (M’00–SM’09–F’16) received his B.Eng. (EE) in 1993 and Ph.D. (EE) in 1996, both from Nanyang Technological University (NTU), Singapore. Currently, he is Advisor (Global Partnerships) at Singapore University of Technology and Design (SUTD), Singapore and Distinguished Professor at Tianjin University, China. He was Chairman of the University Research Board, Associate Provost for Research, and Founding Associate Provost for Graduate Studies and International Relations at SUTD. Professor Yeo is a widely known authority in low-power RF/mm-wave IC design and a recognized expert in CMOS technology. He was a Member of the Board of Advisors of the Singapore Semiconductor Industry Association. Before his appointment at SUTD, he was Associate Chair (Research), Head of Division of Circuits and Systems, and Founding Director of VIRTUS (IC Design Centre of Excellence) of the School of Electrical and Electronic Engineering at NTU. Professor Yeo has secured over S$70 million of research funding as Principal Investigator from various funding agencies and the industry since 2000. He has published 11 books, 7 book chapters, and over 600 international top-tier refereed journal and conference papers. He also holds 38 patents. Professor Yeo holds/held key positions in many international conferences as Advisor, General Chair, Co-General Chair, and Technical Chair. He was awarded the Public Administration Medal (Bronze) on National Day 2009 by the President of the Republic of Singapore and the Nanyang Alumni Achievement Award in 2009 for his outstanding contributions to the university and society. In 2020, he was conferred the Long Service Medal on National Day by the President of the Republic of Singapore. Professor Yeo is a Fellow of the Singapore Academy of Engineering (SAEng), a Fellow of the Singapore National Academy of Science (SNAS), a Fellow of the Asia-Pacific Artificial Intelligence Association (AAIA), and a Fellow of IEEE for his contributions to low-power integrated circuit design. He is the principal author of World University Research Rankings (WURR) 2020. Professor Yeo was recognized among the top 2% of scientists worldwide by Stanford University in 2020, 2021 and 2022.
About World Scientific Publishing Co.
World Scientific Publishing is a leading international independent publisher of books and journals for the scholarly, research and professional communities. World Scientific collaborates with prestigious organisations like the Nobel Foundation and US National Academies Press to bring high quality academic and professional content to researchers and academics worldwide. The company publishes about 600 books and over 170 journals in various fields annually. To find out more about World Scientific, please visit www.worldscientific.com.
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